Abstract
The present and future devices use from basic needs to advance lifestyle are almost governed by electronic devices which are operated by small chips. With technology advancement in controlling the temperature of electronic chips, the performance of electronic devices has been improving. Enhancing the heat dissipation from electronic chips is consequently essential in the safe and continuous operation of electronic devices. The present study investigates the methods of controlling the chip temperature for an enclosure with heat sources on both sides by varying heat sources location and Rayleigh number (Ra). Heat change is achieved by filling the gap between heat sources and cold walls with a fluid at constants Prandtl number (Pr) which converts the heat from heat sources to cold side on the top and bottom walls. Heat transfer is governed by physical mechanisms, which is lamina natural convection for the fixed enclosure. The results of the present study are validated with published work and show good agreement with previous work. The results show that with the increase of Rayleigh number (Ra), the peak temperature of the left, as well as right wall decreases and the maximum heat loss, take place when one side of heat sources on the top and the other in the bottom of the enclosure. At 10, 000 a R = , the peak temperature along the left wall for case II and case IV is 3.7% more as compared to case I and 9.2% more as compared to case III whereas the peak temperature along the right wall for case III and case IV is 5.5% more as compared to case I and 9.2% more as compared to case II.

Key words: Closed Enclosure, Natural Convection, Parallel Plate, Heat Transfer, Rayleigh number

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