Home|Journals|Articles by Year|Audio Abstracts
 

Research Article

EEO. 2021; 20(2): 2009-2017


A Study Of Power Semiconductor Packaging Trends Using Topic Modelling

Neeru Kundu.




Abstract

An analysis was performed on the packaging technology for power semiconductors for electric vehicles. Topic modelling was performed by applying the LDA technique by deriving the error by collecting unstructured research data. It was classified into various topics, and the extracted words for each topic were the definition of technology. Hot topic by topic through regression analysis of frequency by year for trend analysis of each topic and Cold topics were derived, and the trends of power semiconductor packaging technology were analysed. Construction according to withstand voltage Crude technology, input/output related control technology, and heat dissipation technology were derived, and inductance reduction technology was derived. This study will encourage more diversity when performing topic modelling and help determine what topic modelling method best suits.

Key words: Semiconductor, Power, Regression Analysis, Topic Model, IGBT






Full-text options


Share this Article


Online Article Submission
• ejmanager.com




ejPort - eJManager.com
Refer & Earn
JournalList
About BiblioMed
License Information
Terms & Conditions
Privacy Policy
Contact Us

The articles in Bibliomed are open access articles licensed under Creative Commons Attribution 4.0 International License (CC BY), which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons licence, and indicate if changes were made. To view a copy of this licence, visit http://creativecommons.org/licenses/by/4.0/.